OlyBond500 Adhesive Technical Data Bulletin
Versico’s OlyBond500 Adhesive is a two-component, construction-grade, low-rise, expanding, polyurethane adhesive designed for bonding insulation to various substrates. OlyBond500 is compatible with: HP Recovery Board, polyisocyanurate insulation (Polyiso), expanded polystyrene (EPS), extruded polystyrene(XPS), DensDeck®, SECUROCK®, and OSB.
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